3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization ...
At the IEEE International Electron Device Meeting (IEDM) 2022, Intel unveiled research breakthroughs in 2D and 3D IC packaging technologies fueling its innovation pipeline for keeping its promises to ...
The history of electronic design has been defined by repeated waves of major technological change and accompanying business realignment. Many companies have foundered and disappeared when they were ...
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