The Maine Department of Environmental Protection's draft order for Central Maine Power's New England Clean Energy connect Project requires what DEP calls "an unprecedented level" of environmental and ...

Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...

Copper interconnect was introduced to the mainstream at 130nm because of its significant advantages compared to aluminum, such as reduction in resistivity and power consumption and resistance to ...

Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

The problem of variations induced by the chemical-mechanical polishing (CMP) step has been discussed for years in process engineering circles. Briefly, after each layer on the wafer is completed, the ...

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...