TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Apple's 2026 iPhones will use TSMC's next-generation 2-nanometer fabrication process in combination with a new packaging method that will integrate 12GB of RAM, a reputable source of accurate ...
While the iPhone 17 series is still three months away from launching, rumors about next year's iPhone 18 models continue to surface. The latest word comes from Apple analyst Jeff Pu. In a research ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
We’re just weeks away from Apple unveiling its iPhone 17 lineup, but a new report corroborates prior indications that next year’s iPhone 18 models are due for an especially strong performance boost ...
Starting with the Pixel 6 series, Google began developing its in-house Tensor SoC. But that wasn’t the first time the search giant used a piece of custom silicon in its smartphones – the Pixel 2’s ...
Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
At electronica 2022, Renesas Electronics Corp. announced that it has expanded its low-power WAN product line as part of its strategy to deliver connectivity devices for smart cities, smart homes, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback