The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Camtek (CAMT) shares climbed about 8% in afternoon trading as part of a broader move in chip equipment names, with traders positioning ahead of upcoming earnings and fresh commentary on advanced ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...

AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging solutions market as ...

Dutch chip gear maker ASML has lifted the kimono its Twinscan XT:260, a new lithography scanner built for the brave new world of 3D chip packaging. The outfit claims that it is the first machine of ...

SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model ...

The two funds target startups in areas such AI and renewable energy across Asia, the U.S. and the EMEA. Kyocera, one of the world’s largest chip component makers, has unveiled two funds totalling $100 ...

We recently published 13 Best Semiconductor Equipment Stocks to Buy According to Hedge Funds. ACM Research, Inc. (NASDAQ:ACMR) is one of the stocks Jim Cramer recently discussed. ACM Research, Inc.

This article was originally published on ARPU. View the original post here. In a prominently placed interview with China's state newspaper, Huawei founder Ren Zhengfei sent a clear message to ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...