Union City just scored a serious upgrade in the tech world. Japanese materials firm Resonac has opened what industry and ...

By Stephen Nellis and Max A. Cherney SANTA CLARA, California, April 22 (Reuters) - Taiwan Semiconductor Manufacturing Co on ...

Hybrid bonding is driving AI chip packaging demand as backend technologies gain importance in the semiconductor supply chain.

TSMC (TSM) stock climbed 5% after revealing A13 and N2U chip nodes while avoiding ASML's costly high NA EUV machines, ...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Taiwan Semiconductor Manufacturing Co. plans to open an advanced chip packaging plant in Arizona by 2029, expanding its U.S. operations and reducing reliance on Taiwan for final packaging. The ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...

Taiwan TSMC, the world's largest foundry (semiconductor contract manufacturer), said it plans to open a semiconductor packaging plant in Arizona before 2029. /Courtesy of Yonhap News Agency According ...

TOKYO/SEOUL, March 31 (Reuters) - South Korea's Samsung Electronics Co Ltd 005930.KS is considering setting up a chip test line in Japan, five people said, to bolster its advanced packaging business ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...