Each INF Removable BGA Fansink consists of a black anodized aluminum heat sink, fan, thermal interface material, and lightweight clip for mounting the assembly on a BGA device. Ranging in height from ...
For securely mounting heat sinks to flip chips, BGAs, and other pc-board components, the MaxiGRIP attachment system consists of a plastic frame clip and stainless-steel spring clips that are easily ...
pcbCLIP mounts larger heats onto smaller, high-power PCB components. New pcbCLIP frame-and-clip system mounts larger, higher-performing heat sinks onto smaller, high-power PCB components. NORWOOD, ...
TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...
In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.
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