In my November 2024 column, I began discussing the building block approach for crashworthiness testing of composite structures. This approach features a multistep process for designing composite ...
As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin ...
An effective way to deal with this problem is to perform high-level design and testing early in the development process using system-level design techniques. After building a prototype, engineers can ...
Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...
In my two previous columns, I discussed the lower and intermediate levels of the building block approach for crashworthiness testing and analysis of composite structures. I focused on the commercial ...
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