The boom in AI data center building has caused a shortage of memory chips which are also crucial for electronics like ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...

PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC ...

Rising memory prices are creating fresh cost challenges for IC design firms, particularly those producing chips with embedded ...

TAIPEI, Taiwan — China launched two probes targeting the U.S. semiconductor sector Saturday ahead of talks between the two nations in Spain this week on trade, national security and the ownership of ...

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) substrate’ that enhances performance while reducing carbon emissions by half ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Taiwan's semiconductor test supply chain is experiencing strong growth driven by increased demand for AI and HPC chips, industry sources report. Close collaborations with foundries and IC design ...