Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...

Much has been made of next-generation platforms on the horizon from AMD and Intel. Both are planning to embrace DDR5 memory, the former with its Zen 4 platform and the latter with Alder Lake-S. Along ...

Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...

Intel's upcoming Alder Lake CPUs are still a few weeks away from launching, presumably, but there is plenty of related hardware in the wild to keep the leaks flowing. The latest one is an actual photo ...

AMD is all systems go with their next-gen socket AM5, that would replace their traditional motherboard and CPU pin layouts for at least their Ryzen 7000 lineup. And now, it seems like the socket has ...