KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

This is the third article in a six-part series highlighting the sourcing, engineering, commercial availability, and use of ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

TAIPEI, Taiwan — Packaging services provider Advanced Semiconductor Engineering Inc. and PCB maker Compeq Manufacturing Co. Ltd. announced Tuesday (October 28, 2003) that they would set up a joint ...

The growth of large area graphene films with a precisely controlled numbers of layers and stacking orders can open new possibilities in electronics and photonics but remains a challenge. This study ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

As chip makers look for ways to make their products more powerful, Intel says it has come up with a different way to hold transistors in substrate packages. Currently, the company uses organic ...