Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. PI’s F-713 6-axis ...
One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., ...
PI's latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. (Nanowerk News) PI ...
PI’s F-713 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. Image Credit: PI (Physik ...
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