Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the ...
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
As the speeds of various SerDes interfaces move into the multi-gigabits/sec range, more ASIC chips are being designed to have multiple high speed interfaces such as USB 3.0, PCIE Gen3, DDR3, and ...
Facility layout and design is an important component of a business’s overall operations, both in terms of maximizing the effectiveness of the production process and meeting the needs of employees. The ...
The use of FinFET devices in next-generation high-performance, low-power designs is a fundamental shift that is happening in the semiconductor industry. These devices through their smaller sizes, ...
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