Self-aligned lithographic process techniques are playing an increasingly important role in advanced technology nodes. Even with the growing use of extreme ultraviolet (EUV) lithography, ...

Advanced logic scaling has created some difficult technical challenges, including a requirement for highly dense patterning. Imec recently confronted this challenge, by working toward the use of Metal ...

Driven by Moore’s law, memory and logic semiconductor manufacturers pursue higher transistor density to improve product cost and performance [1]. In NAND Flash technologies, this has led to the market ...

Researchers have introduced a novel technique that allows for the direct patterning of two-dimensional (2D) semiconductor materials onto substrates without the need for complex processes. The ...

High-resolution micro-organic light-emitting diodes (micro-OLEDs) have gained significant attention for futuristic microdisplays, particularly in virtual/augmented reality (VR/AR) applications.

August 26, 2014. Today, KLA-Tencor Corp. introduced the WaferSight PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K-T Analyzer 9.0 ...

Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising alternatives to the conventional silicon-based semiconductors currently used ...

Figure 8 compares the starting input (a) to the final manufactured shapes from SADP/SAQP (b) and SALELE (c) processes. The final manufactured patterns in SADP/SAQP have extensive extra dummy metal.