Design engineers using 0.5-mm pitch 48-position MLF/QFN packaged ICs will be interested in the PA-MLF48A-P-Z-02 adapter, which provides high-performance quick prototyping. It comes with a clam-shell ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

Eagan, Minn. — Providing a reliable and small QFN/MLF adapter, Ironwood Electronics has developed a surface-mount emulator foot for 7-mm body, 0.8-mm pitch MLF/QFN ICs such as the Cypress PSOC family.

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand for power ...

Editor’s note: It’s not enough to choose an IC for your design just by what is in the data sheet; you will need to choose the right package and pay attention to the manufacturing and assembly needs of ...