The AI race is causing a memory chip shortage — and that's bad news for the smartphone and PC industries

As AI companies snap up memory chips, smartphone and PC makers face higher costs and tighter supply — which could lead to ...
Hosted on MSN

AMD wants to patent a new DDR5 memory standard with double the bandwidth but we're not expecting to see it in PCs any time soon

An AMD patent application for a new spin on DDR5 PC memory has been spotted. The so-called high-bandwidth dual inline memory module or HB-DIMM is designed to boost memory bandwidth courtesy of pseudo ...
EDN

Advanced Memory Buffers to Improve FB-DIMM Performance

Advanced Memory Buffers, the next generation of FDIMM controllers, allow more DIMMS in a single system, ideal for servers, workstations, storage devices and communication applications. The unique ...
Digi Times

Montage Technology embraces CXL innovation to scale memory and bandwidth for enhanced data center performance

Given the buffer chip's critical role between the processor and DRAM memory, Montage collaborates with major CPU giants such as Intel and AMD, leading silicon IP vendors, as well as the world's top ...
Macworld

The iPhone 18’s A20 chip again reported to use next-gen RAM integration process

Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...
EDN

Crystal LAN™ Ethernet Controller

The CS8900A is a Crystal LAN® 10Base-T Embedded Ethernet Controller featuring a single-chip IEEE 802.3 Ethernet solution and operating at full duplex. It has an on-chip RAM buffers transmit and ...
Nanowerk

Atomically thin magnetic memory films work without insulating buffer

A new study reveals that insulating buffer layers are no longer needed for ultrathin magnetic racetrack devices, unlocking new paths for seamless integration with functional substrates. (Nanowerk News ...