TL;DR: SK hynix is reportedly planning to introduce femto-second grooving and full-cut processes to its HBM4 and 400-layer and higher NAND flash, a move required as semiconductors get thinner and ...

The HPA07 high-performance CMOS semiconductor process from Texas Instruments will foster development of advanced analog chips, including analog-to-digital and digital-to-analog converters, op amps, ...

Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...

"We are excited to partner with Global Zeus to bring their innovative single wafer processing systems to the US market," said Rezwan Lateef, President of Yield Engineering Systems. "Global Zeus has a ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

A technical paper titled “Review of virtual wafer process modeling and metrology for advanced technology development” was published by researchers at Coventor Inc., Lam Research. “Semiconductor logic ...

DAINCUBE accelerates semiconductor manufacturing innovation with its integrated robot control solutions, achieving a 90% reduction in teaching time and significant yield improvements. As Korea's only ...

Samsung Electronics has succeeded in developing a new gas to replace trifluoromethane (CHF₃), which is used in semiconductor etching processes. The aim is to speed up the achievement of the "carbon ...