TL;DR: SK hynix is reportedly planning to introduce femto-second grooving and full-cut processes to its HBM4 and 400-layer and higher NAND flash, a move required as semiconductors get thinner and ...

Acquisition extends Siemens' comprehensive EDA software portfolio with computational metrology and inspection to help ...

Wafer manufacturers saw their output slide by 250m sq in of silicon from the first to the second quarter as the full impact of the slowdown in high-tech business hit the wafer production sector. Total ...

The HPA07 high-performance CMOS semiconductor process from Texas Instruments will foster development of advanced analog chips, including analog-to-digital and digital-to-analog converters, op amps, ...

Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...

Canopus AI has introduced 'Metrospection,' an AI-driven approach designed to improve workflows in wafer and mask metrology.

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Forge Nano's breakthrough changes that equation completely by simultaneously delivering 1000:1 aspect ratio conformality, ALD-quality film uniformity and speed. This is one of the rare semiconductor ...

The "Thin Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering.The thin wafer market is experiencing robust growth, poised to expand from $12.57 billion in 2025 to $19.45 ...