Microsemi Corporation introduced the industry's smallest hermetic surface mount package for power transistors and diodes. Microsemi pioneered the development of the new industry-standard U4 package, ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
The compact U4 is 70 percent smaller than its U3 predecessor and available now exclusively from Microsemi. The package is constructed with aluminum nitride ceramic, which provides excellent heat ...
Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...
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