RESEARCH TRIANGLE PARK, N.C. — Flip-chip technology supplier Unitive Inc. here today announced qualification of its eutectic wafer-bumping process for volume production of high-density ...
Taiwanese test and packaging house Advanced Semiconductor Engineering Inc. (ASE) said today that it has successfully completed internal development of electroplated wafer bumping technology on 200mm ...
Custom DC positioners with theta-X planarizing capability and true Kelvin probes have allowed for successful demonstration of consistent and repeatable test results in fully automatic micro-bump wafer ...
MINNEAPOLIS--(BUSINESS WIRE)-- CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the SEMICON ...
At the recent IEEE Electronic Components and Technology Conference (ECTC), Imec presented a paper on a fine-pitch hybrid wafer-to-wafer bonding technology for heterogeneous integration. Imec described ...
The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...
Interconnect, a wafer bumping service company, announced qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications, producing bonds that are stable at high ...
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