Oki Electric Industry and Nisshinbo Micro Devices in Tokyo are collaborating to develop a new type of thin-film 3D analogue IC. These chips are designed to ...
Malaysia today launched its second integrated circuit (IC) design park in Cyberjaya, marking another milestone in its bid to ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Silicon X Sdn Bhd, a homegrown integrated circuit (IC) design company, has achieved a major milestone in Malaysia’s ...
Last year, we saw the announcement of a chip design hub in Puchong, Selangor last year. It was the first of its kind, and now ...
Recently, the scientists have successfully generated a three-dimensional microstructural “panoramic image” with ...
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