NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Singapore-based STATS ChipPAC has cumulatively packaged 100 million chips based on copper-wire bonding process since it started using the process in November 2009, and expects to increase the ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...

This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL). Save my User ID and ...

SANTA CLARA, Calif. — Chip-packaging giant Advanced Semiconductor Engineering Inc. (ASE) today unveiled a new wire bonding technique that reduces the die size but increases I/O for complex chips.