Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

The eBeam Initiative’s annual lunch at SPIE Advanced Lithography and Patterning has long served as a focal point for eBeam technology education for the industry. This year marked our 17th gathering, ...

Key Takeaways: There is no single processor capable of executing everything efficiently, meaning that multiple processors are required. Maximum efficiency is gained by minimizing the movement of data.

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Researchers from Rotonium, Centre for Quantum Technologies at National University of Singapore, Inveriant, Politecnico di Milano, and CNIT published a technical paper titled “Design and Benchmarking ...

AI is becoming part of the everyday work of IP developers who build, verify, package, support, and sell reusable design blocks. It also is changing what the IP does, how it’s created, verified, and ...

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.

The conversation about agentic AI in semiconductor and PCB design tends to focus on capability: what the agent can do, how much time it saves, and which parts of the workflow it can automate. That is ...