AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

Moving from large language models in the cloud to small language models at the edge is much more complicated than just slimming down the algorithms. It requires changes in both hardware and software, ...

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to ...

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold.

System-level energy and bandwidth pressures are pulling optics into the package faster than the manufacturing flow can mature. Photonics combines front-end fabrication, materials, thermal, cleanliness ...

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.

Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as ...

Researchers from Rotonium, Centre for Quantum Technologies at National University of Singapore, Inveriant, Politecnico di Milano, and CNIT published a technical paper titled “Design and Benchmarking ...

The AI revolution is significantly outpacing the IC industry’s ability to sufficiently test multi-chip systems for all necessary failure mechanisms at probe, final test, and system-level test. The ...