esmo group (esmo) announced the launch of ares auto setup, the world’s first final test manipulator capable of automated test head finding and positioning. esmo group (esmo) announced the launch of ...

DFB laser dies bonded onto a 300mm silicon photonics wafer. imec together with Sivers Photonics (formerly CST Global, and a subsidiary of Sivers Semiconductors), and ASM AMICRA Microtechnologies ...

HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...

STMicroelectronics and GlobalFoundries announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing ...

The meaning of the term "high power LED" is rapidly evolving. Although a 350mA LED could easily earn the stamp of "high power" a few years ago, it could not hold a candle to the 20A LED or the 40A ...

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HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance ...

Holtek announced the release of its new Enhanced 24-bit A/D Arm Cortex-M0+ MCU, the HT32F59041. The device is especially suitable for high accuracy measurement products such as electronic scales, ...

Holtek announced the release of its new wireless charger transmitter Flash MCU, the HT66FW2350. The device includes a host of wireless charger transmitter required functions such as AM demodulation ...

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