Orbital data centers, defense systems, quantum computing, particle physics, and advanced manufacturing are raising the bar ...
Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM ...
Researchers at Georgia Institute of Technology, Qatar Computing Research Institute, and Purdue University published a ...
Researchers at Infineon Technologies and Technical University of Munich published a technical paper titled “From Physical Devices to RTL Models: Abstraction and Validation in Hardware Engineering.” ...
As models evolve faster than silicon cycles, chip architects must balance flexible compute, data movement, and ...
The shift from software-defined to AI-defined vehicles raises questions about whether the hardware can keep up.
A mixture of expert agentic AI systems can focus on their tasks with or without a commanding general, but challenges remain ...
Researchers at Purdue University and the UCLA published a technical paper titled “Experimental Evidence for the Impact of ...
Digital twins and thermal sensors; agentic AI workflows; physical AI needs new silicon; RF design changes.
Larger packages, finer routing, and embedded functions are pushing advanced substrates toward application-specific designs.
Chiplet-based architectures are reshaping how high-performance systems are built, enabling designers to partition functionality across multiple dies in a single package for better scalability, yield, ...
Unified Compression and Streaming Fabric (SF) provide a practical implementation methodology capable of scaling from individual IP blocks to large AI accelerators containing hundreds of millions of ...
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