Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

Quantum computing has imprinted itself on our society as a weird, wacky way of computing that most of us can’t comprehend.

AI is rocketing ahead. It is the biggest industrial revolution of our age. AI adoption is growing, but still most are at early stages of learning. Anthropic, the leading frontier model provider with ...

As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold.

Ethernet auto-negotiation; multiphysics to avoid overdesign; PCB design reuse; mobile LLM quantization; modeling BSPDNs.

In this white paper, we will discuss the emerging trend in which hardware is increasingly designed to meet the end functionality of today’s systems, which is largely defined in software. This emerging ...

Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as ...

The AI revolution is significantly outpacing the IC industry’s ability to sufficiently test multi-chip systems for all necessary failure mechanisms at probe, final test, and system-level test. The ...

Characteristics once primarily associated with extending smartphone battery life map directly onto the needs of real-time on-device inference.

As AI infrastructure fragments into specialized tiers, CPUs are becoming the orchestration layer for agentic workloads.