Abstract: Multiple parallel insulated-gate bipolar transistor (IGBT) modules can enhance the current-carrying capacity of a power converter. However, due to parameter inconsistency of IGBT modules and ...
Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...
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