A wide of array of advanced controllers arrived in 2025, marked by high integration and enhanced intelligence in solutions ...
Abstract: SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties ...
EDN announces this year’s winners of the Electronic Products Product of the Year Awards, selected by the editors.
Researchers at SUPSI found that six Swiss PV systems installed in the late 1980s and early 1990s show exceptionally low degradation rates of just 0.16% to 0.24% per year after more than 30 years of ...
A small portable device featuring timer, clock, and calendar functions, equipped with a simple and functional interface and a ...
Abstract: Fatigue-induced delamination of the direct-bonded copper (DBC) solder layer is a critical and latent failure mode in multichip Insulated Gate Bipolar Transistor (IGBT) power modules. To ...
Cree LED introduces its Level 2 (L2) PCBA solutions – fully assembled LED modules engineered for reliability, scalability and simplified sourcing. As demand grows for integrated LED platforms, the new ...
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