Yesterday, a report emerged claiming that Intel is planning to release its upcoming 14-nanometer Broadwell architecture processors as a ball grid array (BGA) rather than an land grid array (LGA) ...

Rumours abound that Intel's next-next-gen CPU, the Broadwell, will be soldered to motherboards rather than socketed - and that consequently motherboards will become very difficult to swap or upgrade.

Rob founded Techgage in 2005 to be an 'Advocate of the consumer', focusing on fair reviews and keeping people apprised of news in the tech world. Catering to both enthusiasts and businesses alike; ...