This article was updated April 26, 2023. It was originally published Oct. 12, 2018. Heat treatments let engineers and metallurgists tailor the properties of metal parts so that they are a better fit ...
Abstract: Through silicon via (TSV) technology has been widely employed as a promising 3-D packaging technology to achieve significant reduction in device dimensions. Due to the existence of ...
Abstract: In this paper, a fast rotor design method for synchronous reluctance machines (SynRM) is proposed, utilizing partly concentric circular flux barriers. The parametrization model exhibits a ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results