A new solar panel reaches up to 865 W, setting a historic record in power and efficiency for large-scale solar projects.
In a study published in Nature on January 28, a research team led by Eric H. Xu (Xu Huaqiang) from the Shanghai Institute of Materia Medica of the Chinese Academy of Sciences, along with Ma Xiong from ...
High-power modules use substrates to house the semiconductor device and for electrical insulation. These substrates are constructed with thermally conductive dielectric material sandwiched between two ...
Honor is set to launch its first Honor Win series phones in China today. The Win and Win RT are performance-focused handhelds with Snapdragon 8 Elite chip and a massive 10000mAh battery. Next in ...
3300V and 2300V devices based on GeneSiC Trench-Assisted Planar technology represent significant step towards 10 kV SiC solutions Navitas Semiconductor is announcing the sample availability of its new ...
With additional optical and electrical optimization at the module level, along with high-density encapsulation, total module power is expected to exceed 680W. DAS Solar’s progress in DBC technology ...
DAS Solar has achieved a significant new milestone, with its independently developed Diamond series back-contact (DBC) module delivering an output of 664.9W and a full-area conversion efficiency of 24 ...
Texas Instruments Inc. (TI) announced several power management devices and a reference design to help companies meet AI computing demands and scale power management architectures from 12 V to 48 V to ...
Aluminum nitride (AlN) is a large bandgap semiconductor ceramic with a hexagonal wurtzite crystal framework, composed of alternating layers of light weight aluminum and nitrogen atoms bound through ...
Infineon Technologies AG claims the industry’s first trans-inductance voltage regulator (TLVR) module with the launch of its OptiMOS TDM22545T dual-phase power module, addressing the continued need to ...
Power density plays a critical role in making power electronic systems smaller, more efficient, and more cost-effective. As power density increases, so does the heat generated inside a device.