Automation World

Robust Integration Between Process and Business Layers

Nowadays, to have the edge over competitors, modern manufacturing automation systems have to be employed. They consist of Information Technology (IT) and control systems at business and process levels ...
Business Wire

Search For The Next: UK Collaboration Unveils Bizen® a Transistor Wafer Process Technology Promising to Slash Lead Times, Wafer Area and Process Layers While Increasing Speed ...

NOTTINGHAM, England--(BUSINESS WIRE)--A UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab may be set to disrupt the semiconductor industry by ...
Mena FN

Silicon Genesis Extends Its NANOCLEAVETM Layer Transfer Process For 3DIC Integration To Interconnect Network Layers

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
EDN

SiGen expands SOI process to cover thick and thin silicon layers

CAMPBELL, Calif.–Silicon Genesis Corp. today announced an expansion of its silicon-on-insulator wafer production technology to deliver SOI substrates with a greater range silicon-thickness layers for ...