Investing.com -- Intel is positioning its Embedded Multi-die Interconnect Bridge-T, or EMIB-T, as a potential alternative to ...

Biocomputing research is testing living neurons for computation as scientists look for energy-efficient alternatives to ...

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

If the industry wants to keep up with the exploding demand for AI, the only way forward is to reconsider how we architect ...

Automated-ready SPINx series and precision hotplates now shipping without lead times You can now order our new improved and innovative designed POLOS® SPIN150x model. The POLOS® SPIN150x offers ...

The benefits of AoP radar sensor technology will be apparent in a range of application types, reducing RF design complexity ...

Increased fiber densification, cloud focus and accelerated pace of 5G deployment should help the Zacks Communication - ...

The tech giant is pivoting its strategy to focus on processors to support AI workloads, meaning less capacity for chips for PCs.

A hair-thin chipset could enable smart wearables to process advanced functions without a phone, revolutionizing future technology.

Existing technology is being upcycled and deployed in new ways as companies seek to measure more data, more accurately.

Traditional chips depend on flat, inflexible wafers; the Fudan team replaced these with elastic substrates capable of hosting resistors, capacitors, diodes, and transistors. Once patterned, each ...

ASE Technology stock is poised for AI-driven packaging growth from 2026 as TSMC outsources CoWoS. Learn more about the ...