STMicroelectronics and GlobalFoundries announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing ...
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...
HSINCHU, Taiwan –MediaTek announced a new addition to its ASIC lineup with a 56G SerDes IP chip available with silicon-proven 7nm FinFET process technology. MediaTek’s 56G SerDes is a high-performance ...
HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance ...
The Keysight UXG agile signal generator accelerates the integration of newly acquired electronic warfare intelligence into up-to-date signal scenarios. Keysight Technologies announced N7660B Signal ...
DFB laser dies bonded onto a 300mm silicon photonics wafer. imec together with Sivers Photonics (formerly CST Global, and a subsidiary of Sivers Semiconductors), and ASM AMICRA Microtechnologies ...
Taoyuan, Taiwan - Inotera Memories, Inc. today announced the appointment of Mr. Richard Mealey-Ozawa as Chief Financial Officer, effective August 9th, 2016. TAIPEI, Taiwan - Taiwanese memory ...
Holtek announced the release of its new wireless charger transmitter Flash MCU, the HT66FW2350. The device includes a host of wireless charger transmitter required functions such as AM demodulation ...
esmo group (esmo) announced the launch of ares auto setup, the world’s first final test manipulator capable of automated test head finding and positioning. esmo group (esmo) announced the launch of ...
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