Parallel piezo aligners with fly height sensors enable faster PIC wafer testing.

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...

Intelligent algorithms, faster motion controllers and the latest multi-axis mechanical motion systems allow to reduce the alignment time of photonics components and silicon photonics chips by 99% or ...

Data centers are undergoing a dramatic transformation to reduce the power consumption of high-speed data transmissions by 70% or more with co-packaged optics. By moving optical transceivers from the ...

Research on ONNs began as early as the 1960s. To clearly illustrate the development history of ONNs, this review presents the evolution of related research work chronologically at the beginning of the ...

Photonic integrated circuits (PICs) are on the verge of significant disruption by enabling novel applications. This success largely relies on wafer-level miniaturized photonic device fabrication, ...

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