New York, United States, Jan. 10, 2024 (GLOBE NEWSWIRE) -- With the proliferation of new IC types such as BGA (ball grid array) and CSP (chip scale package), which require different package carriers, ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

On April 26, Joseph HS Tung, CFO and vice president of Advanced Semiconductor Engineering (ASE) group, pointed out that IC substrate accounts for 60-80% and 30-50% of ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...