Abstract: This work reports an on-chip heater structure fabricated in the Front End of Line (FEOL) on a versatile ring-oscillator (RO) array utilized to conduct statistical characterization of on-chip ...
Abstract: Wafer-to-wafer (W2W) hybrid bonding is a crucial enabler of higher performance electronic devices. Water desorption during the annealing process facilitates the formation of interfacial ...
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