KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.
The Global Electronics Association has published a new international standard, IPC‑6921, establishing formal requirements and acceptance criteria for organic integrated circuit (IC) substrates used in ...
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
The growth of large area graphene films with a precisely controlled numbers of layers and stacking orders can open new possibilities in electronics and photonics but remains a challenge. This study ...
This is the third article in a six-part series highlighting the sourcing, engineering, commercial availability, and use of ...
As chip makers look for ways to make their products more powerful, Intel says it has come up with a different way to hold transistors in substrate packages. Currently, the company uses organic ...
Traditionally employed to make light-emitting diodes (LEDs), sapphire substrates now are being used by Apple Inc. and other smartphone makers as covers for camera lenses and home buttons, contributing ...
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