Abstract: Among different modular multilevel converters (MMCs) submodules (SMs), the clamp double submodule (CDSM) has the capability of dc-fault current clearing with a relatively small number of ...
Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
VLM-3R is a unified Vision-Language Model (VLM) framework integrating 3D reconstructive instruction tuning for deep spatial understanding from monocular video. The rapid advancement of Large ...
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