Self-aligned lithographic process techniques are playing an increasingly important role in advanced technology nodes. Even with the growing use of extreme ultraviolet (EUV) lithography, ...
A new approach combining atomic layer deposition and organic film etch process may solve critical challenges in the various processes in advanced nodes. We demonstrated a high selective and ...
High-resolution micro-organic light-emitting diodes (micro-OLEDs) have gained significant attention for futuristic microdisplays, particularly in virtual/augmented reality (VR/AR) applications.
Upcoming 14A and 10A process nodes will use high-NA EUV anamorphic scanners, which will require two stitched half-fields to achieve the equivalent wafer exposure area of previous-generation scanners, ...
New dry resist technology being developed with ASML and imec will help to extend EUV lithography’s resolution, productivity and yield FREMONT, Calif., Feb. 26, 2020 (GLOBE NEWSWIRE) -- Lam Research ...
Two-dimensional (2D) semiconductors, materials that can conduct electricity and are only a few atoms thick, are promising alternatives to the conventional silicon-based semiconductors currently used ...
August 26, 2014. Today, KLA-Tencor Corp. introduced the WaferSight PWG patterned wafer geometry measurement system, the LMS IPRO6 reticle pattern placement metrology system and the K-T Analyzer 9.0 ...
Figure 8 compares the starting input (a) to the final manufactured shapes from SADP/SAQP (b) and SALELE (c) processes. The final manufactured patterns in SADP/SAQP have extensive extra dummy metal.
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