Abstract: This article demonstrates a low-cost micro shell resonator forming by the wafer-level negative pressure driven reflow process. Negative pressure in the sealed mold cavity of the bonded fused ...

Dr. Witt is the author of “The Radical Fund: How a Band of Visionaries and a Million Dollars Upended America.” In a year when the United States seemed more split than ever, Americans united in one way ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the ...

With nitrogen generators, companies can ensure a more stable, repeatable process that increases product reliability and overall yield. The trend toward miniaturisation, particularly in sectors such as ...

ABSTRACT: Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to ...

A thermal processing expert’s take on which tests are ideal for comparisons. I get asked how I would evaluate the performance of a reflow oven because of my experience with oven testing and ...

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An ...

SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) ...

Abstract: Because of the tendency toward downsizing and the rising complexity of printed circuit board (PCB) design, monitoring and optimizing the soldering reflow process (SRP) has become an ...