Abstract: Hybrid wafer bonding is a key technology for enabling fine-pitch 3-D integration, yet its quality remains highly sensitive to wafer warpage and misalignment. This study develops a 3-D finite ...
Diffusion policy exhibits promising multimodal property and distributional expressivity in robotic field, while not ready for real-time end-to-end autonomous driving in more dynamic and open-world ...
Abstract: Photovoltaic (PV) temporal simulation is a core technology for PV planning analysis. This paper proposes the Weather Diffusion Transformer (Weather-DiT), which is based on a diffusion model ...
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