High Precision IC Bonder 8-12 Inch Wafers
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YouTubeSuneast Intelligent Equipment Technology Co., LTD
High Precision IC Bonder 8-12 Inch Wafers
Introducing the WBD2200 PLUS High Precision IC Bonding Machine, engineered for superior performance with 8-12 inch wafers. This advanced die bonder is your solution for mass wafer loading, SIP packaging, Memory Stack Die, CMOS, and MEMS processes. Achieve unparalleled accuracy with placement precision of ≥±15um@3σ and angle accuracy of ±0. ...
2 days ago
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