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Get a first look at the innovations shaping the future of advanced electronic packaging. Explore new technologies, design tools, and manufacturing solutions coming to APEX EXPO. Bundle and save 70% with the All-Access Package! | Global Electronics Association
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I interviewed @bubbleboi about his ratings of AI supply chain bottlenecks.We talked about DRAM, advanced packaging, CPO, HBF, PCBs, power delivery, etc. 0:00 HBM, DRAM, the cartel7:24 Silicon photonics, CPO, Lumentum lasers11:35 Advanced packaging: TSMC vs Intel13:49 HBF: Sandisk/SK monopoly window17:02 Memory accelerators + TurboQuant22:35 PCBs + Unitika27:27 Power: transition from 48V to 800V31:32 Outsourced assembly + test, fiber coupling36:23 HBM vs DRAM vs NAND in 2-3 years42:03 Where will
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Inside the Advanced Packaging Matrix Advanced semiconductor packaging is rapidly becoming the critical lever for high-performance AI chips, chiplets, and next-generation electronics. Technologies like InFO, FOWLP, EMIB, and Foveros are reshaping manufacturing, improving power efficiency, and enabling scalable, high-bandwidth solutions for HPC, mobile, and RF applications. At the same time, the industry faces growing demand for technical talent and leadership, highlighting the importance of strat
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